HD DIFB 5194006-3-R
5194006-3-R | |
Computed Tomography (CT) | |
Other Computed Tomography (CT) | |
GE Sistemas Médicos de México S.A. de C.V | |
GE HealthCare | |
Enter your approval number and submit to add item(s) to cart.
Please enter approval number
OR
Don't know your approval number? Call 800-437-1171
Enter opt 1 for the first three prompts, and have your System ID available.
If you add item(s) to cart and submit your order without the
approval number, GE will contact you before your order
can be confirmed for shipment.
Select your approver's name and submit to add item(s) to your cart
Please Select Approver Name
OR
Don't know your approval number? Call 800-437-1171
Enter opt 1 for the first three prompts, and have your System ID available.
If you add item(s) to cart and submit your order without
selecting an approver, GE will contact you before your order
can be confirmed for shipment.
Características
- Field Replaceable Unit (FRU)-can be replaced or removed quickly and easily
- High instantaneous (burst) data-transfer rates
- Optimized performance
- Vacuum sealed packaging provided
Descripción del producto
The HD DIFB (High Definition DAS Interface Board) is the Circuit Board used in the Subsystem Assembly, DAS, VCT HD, Subsystem Assembly, DAS, HALO LS64, Sherlock to HALO Upgrade Kit, CT DAS and other medical equipment as applicable which comes under the modality of X-Ray. This assembly consists of required resistors and capacitors, LED display green light angle SMT, inductors, clock driver, test point, A to D converter, surface mount Pin-strip header, Zener diode, Protection fuse, IC amplifier, operational amplifiers, semiconductors, connector pin, memory flash, logic interface driver, ferrit chip, reference voltage regulator, lead free power supply sequencer, LVDS Dual CMOS Differential Line Receiver, Crystal oscillator, resistor array, linear multiplexer, Cast CAN IP Core, spring pin, spacer, heat sink, Philips head screw assembly, flip chipunderfill encapsulate. The DIFB receives scan data from the A/D Modules, performs low level processing on the data and sends the processed scan data to the DAS Controller Board (DCB). The GE product is an Innovation which fits well into versatile customer needs. The part is diligently designed for superior performance and reliability. It is securely packed inside a high quality packing box to avoid physical damage during transit and labeled with details about the product, Quality Assurance (QA) seal and shipment details.
Características adicionales
- Using high quality resistors, capacitors and inductors
- Using high quality amplifiers and transistors
- Enhanced durability
- Can be operated at maximum operating temperatures
- Using high quality ICs
- Has undergone special test specification for testing the assembly
- It is having the maximum operating temperatures
- ROHS compliant component